| 摘要 |
PURPOSE:To miniaturize a thermostat unit by a method wherein, in order to separately control the temperature of multiple parts of a semiconductor printing device, only the heating parts and controlling parts of respective thermostats are separately provided while a blower and a refrigerator required of large space are used in common. CONSTITUTION:Both the air inside a chamber 1 and the air inside a semiconductor printing exposure device 4 are fed to a cooling air feeder to be cooled down by a refrigerator 5 further fed back to the chamber 1 through a feeder duct 3 by a blower 6. The feeder duct 3 is dividedly piped in three ways inside the chamber 1 to distribute the cooling air in respective ways; the cooling air is heated by respective heaters; any dust in the cooling air is removed by respective filters 8 and the cooling air is fed as the temperature controlling air entirely around the semiconductor printing exposure device 4 or as the partial temperature controlling air inside the device 4. At this time, the temperature of feeder air is detected by respective temperature sensers 8 to be compared with the set up temperature by controllers 10 so that the output of heaters 7 may be controlled to keep the temperature of feeder air within the set up range of temperature. |
