| 摘要 |
A probe apparatus is provided for on-wafer testing of an electrical circuit, the probe apparatus comprising a base plate formed from an electrically conductive material, the base plate including top and bottom surfaces; a substrate formed from a dielectric material, the substrate including top and bottom surfaces, the top surface of the substrate being electrically connected to the bottom surface of the base plate; at least one microstrip transmission line secured to the bottom surface of the substrate, the microstrip line including a first end and a second end; a coaxial connector including a center conductor in electrical contact with the first end of the microstrip transmission line; and a needle probe electrically connected to the second end of the microstrip transmission line, the needle probe extending in a direction substantially away from the base plate.
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