发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to judge respectively package bases sent in a reverse direction by optical recognition in case such the package bases come being sent by a method wherein each pattern at the corner parts of groove parts and (or) bonding post parts on a diagonal line to pas through the central point of the groove part is constituted in a pattern different from each other. CONSTITUTION:The parts other than Au-plated parts 4 and 5 are the texture of a package base 1, the part of the texture is turned into black (color) in an optical recognition by black and white, while marks 4 for cavity position recognition and lead bonding post parts 5, which are the Au-plated parts, are turned into while (color). In these marks 4 and post parts 5 on the diagonal line to pass through the central point 3 of a cavity part 2, the patterns on the left upper side and the right lower side are respectively constituted in a pattern different from each other. Thereby, in case a package base comes being transferred from the former process reversing the left upper side and the right lower side, for example, it can be known that the package base 1 is not one which came being sent in the normal direction.
申请公布号 JPS6342132(A) 申请公布日期 1988.02.23
申请号 JP19860185107 申请日期 1986.08.08
申请人 AKITA DENSHI KK;HITACHI LTD 发明人 YOSHIDA MASANORI;SUGIMOTO TATSUO
分类号 H01L21/52 主分类号 H01L21/52
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