首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPS6326944(U)
申请公布日期
1988.02.22
申请号
JP19860119565U
申请日期
1986.08.04
申请人
发明人
分类号
H01H73/00;H01H71/02;H01H71/08;(IPC1-7):H01H73/00
主分类号
H01H73/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
TRIARYLSULFONIUM SALT COMPOUND, ACTIVE ENERGY RAY-CURABLE COMPOSITION AND ACTIVE RAY-CURABLE INKJET INK COMPOSITION
IMAGE RECORDER
SHUT-OFF DEVICE AND FUELING DEVICE OF FUEL TANK
DOUBLE-SIDED POLISHING METHOD OF SEMICONDUCTOR WAFER, AND POLISHING EQUIPMENT FOR USE THEREIN
POLISHING PAD AND ITS MANUFACTURING METHOD
AUTOMATIC REGISTRATION CONTROL DEVICE/METHOD
MAGNETIC IRON OXIDE PARTICLE POWDER
OPTICAL RECORDING MEDIUM
EFFECTIVE PACKAGE FOR COSMETICS, AND PARTICULARLY MASCARA UNIT
PIPE TYPE BALL-POINT PEN TIP, AND ITS MANUFACTURING METHOD
INFORMATION PROCESSOR, METHOD OF CONTROLLING CORRECTION THEREOF AND PROGRAM
PRINTING DEVICE, PRINTING SYSTEM AND PROGRAM
DOUBLE WRITING UTENSIL
BALL-POINT PEN TIP
IMAGE PRINTING DEVICE, IMAGE PRINTING INSTRUCTION DEVICE, DIRECT PRINTING SYSTEM AND PRINTING CONDITIONS SETTING METHOD
AROMATIC POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME AND MOLDED ARTICLE THEREOF
FUEL INJECTION VALVE
ELECTRONIC COMPONENT WITH FLEXIBLE BONDING PART, AND METHOD FOR MANUFACTURING SUCH COMPONENT
SEMICONDUCTOR INTEGRATED CIRCUIT
MICROELECTRONIC LEAD STRUCTURES EQUIPPED WITH DIELECTRIC LAYERS
