| 摘要 |
PURPOSE:To conduct handling for housing, carrying and delivering a semiconductor device at a carrier unit by forming a rack structure by integrally combining a plurality of tubes and positioning and housing the rack structures in a taking- in-and-out-free manner in parallel in the vertical direction. CONSTITUTION:A plurality of tubes 311 housing semiconductor devices 1 under the state of alignment are each bonded integrally in the vertical direction, and one end sides of respective tube are opened, and the other end sides are closed, thus shaping a plurality of rack structures 3. A carrying frame body 4 positioning and housing these each rack structure in a taking-in-and-out-free manner in the vertical direction under a parallel state is mounted. The housing, carrying and delivery of the semiconductor devices to each tube can be conducted at a predetermined housing position or taking-in-and-out position in the carrying frame body. The semiconductor devices can be delivered at a carrier unit between the carrier device and a treating device thus easily automating the delivery of the semiconductor devices to the treater. |
