| 摘要 |
PURPOSE:To prevent the warping of a mask sheet used to form thin SiC films and to shorten the time required to form the films by tapering the holes in the mask sheet so that they are extended toward an SiC flying direction. CONSTITUTION:When SiC is deposited on an insulating substrate by sputtering through a metallic or ceramic sheet 1 having holes 2 as a mask sheet, the holes 2 in the sheet 1 are tapered 3 so that they are extended toward an SiC flying direction. Since the mask sheet 1 for sputtering hardly casts a shadow on the substrate by the tapering even in case where the thickness of the sheet 1 is so increased as to make warp during sputtering negligible, the sputtering time required to obtain SiC films of a prescribed thickness is not prolonged. Accordingly, SiC films of the prescribed thickness are formed on the insulating substrate in a short time with little warp. |
