| 摘要 |
PURPOSE:To manufacture am air-core coil capable of corresponding to high density packaging easily by mounting a bender for bending a wire rod to a V shape toward a lower section to soldering equipment, arranging a solder tank to the lower section of the bender and relatively guiding the wire rod in an ascendable and descendable manner to the solder tank. CONSTITUTION:A wire rod 5 is bent to a V shape and the tips of the bent sections are dipped in molten solder 39, thus forming solder plating sections 51 in predeter mined width to the wire rod 5 at regular intervals. There are the sag 39a of solder and the adhesion of the residue of a resin film at the tip section of the wire rod 5a bent to the V shape when the wire rod 5 is pulled up from molten solder 39, but there is the tip section just at the central section of the solder plating section 51, and a solder plating section 51b except the central section 51a is dipped in molten solder 39 approximately vertically, thus executing solder plating having excellent quality. When the tip of the wire rod 5 is molded to a coil 10 and separated, the central section 51a positioned just between the coil and the coil is cut off, thus improving the quality of the solder plating of a lead end for the coil. |
