发明名称 WAFER EXPOSURE EQUIPMENT
摘要 PURPOSE:To make accurate exposure possible, by providing an exposure region measuring part an arithmetic circuit, a driving circuit and a wafer chuck having a plurality of piezoelectric driving pins, calculating correction quantity, and making a focal plane and an exposure region acurately coincide with each other in the exposure region of wafer surface. CONSTITUTION:Automatic correction of exposure region applying a wafer chuck 41 having piezoelectric driving pins 44, a driving circuit 45, an exposure region measuring part 55 and an arithmetic circuit 56 is executed as follows; a wafer chuck 41 is horizontally transferred under the condition where voltage is not applied to the piezoelectric driving pins 44, and the exposure region 50 of a wafer 42 fixed on the chuck is set at a specified position corresponding to a projection lense 40. Then the upper and the lower positions of a plurality of points on the exposure region 50 are measured. In this measurment, the output light 57 of a light emitting element 46 makes an incidence on the respictive positions corresponding to the piezoelectric driving pins 44. When the reflected light signals are input to the arithmetic circuit 56 via sensors 54, the arithmetic circuit 56 calcurates the difference between each incidence point on the exposure region 50 and the focal plane of the projection lense 40, and the correction quantity is output to a driving circuit 46. which applies a voltage corresponding to the correction quantity to the piezoelectric driving pins 44 corresponding to each point of the exposure region 50, and makes the wafer chuck shift according to the correction quantity.
申请公布号 JPS6336526(A) 申请公布日期 1988.02.17
申请号 JP19860179494 申请日期 1986.07.30
申请人 OKI ELECTRIC IND CO LTD 发明人 SADAMURA MASAO
分类号 G02B7/28;G03F7/20;G03F9/00;H01L21/027;H01L21/30 主分类号 G02B7/28
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