| 摘要 |
PURPOSE:To make it possible to change visual inspection by an operator into automatic inspection and to shorten the time of inspection, by converting images, which are taken by using a low magnification camera and a high magnification camera, into a binary coded picture, and detecting deviation in bonding the wire of an electrode pad part, the diameter of a ball, the shape of the ball, yield of separation and the like. CONSTITUTION:Images, which are taken by using a low magnification camera 1 and a high magnification camera 5, are converted into a binary coded picture by a binary coded picture device. The deviation of the mounting position of an element pellet is obtained by a pattern matching method. Thereafter, deviation in bonding the wire of the electrode pad part of the element pellet, the diameter of a ball, the shape of the ball, yield of separation and the like are detected based on the position of the center of the ball of the wire, which is bonded to the electrode pad of the element pellet, the diameter of the ball and the roundness of the ball. Furthermore, e.g., the bonding state of a mounting solder material at the rear surface of the element pellet is judged based on an image, which is obtained through an ultrasonic wave microscope including an acoustic lens 3. Images, which are obtained by using a prism 6, an optical fiber 21 and an image comera 20, are converted into a binary coded picture. The height of a wire loop is detected, and whether the result is within a specified range or not is judged. |
