发明名称 |
Adjustable heat pipe thermal unit |
摘要 |
Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed. |
申请公布号 |
US9366482(B2) |
申请公布日期 |
2016.06.14 |
申请号 |
US201213631957 |
申请日期 |
2012.09.29 |
申请人 |
INTEL CORPORATION |
发明人 |
Yang Jin;Shia David |
分类号 |
F28D15/02;H01L23/433;H01L23/40;H01L23/427;H01L23/00;F28F13/00 |
主分类号 |
F28D15/02 |
代理机构 |
Konrad Raynes Davda & Victor LLP |
代理人 |
Konrad Raynes Davda & Victor LLP ;Raynes Alan S. |
主权项 |
1. An assembly comprising:
a substrate including a first die structure and a second die structure positioned thereon; a first plate; a second plate positioned on the first die structure, the second plate positioned between the first plate and the first die structure; a third plate positioned on the second die structure, the third plate positioned between the second die structure and the first plate; and an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being substantially C-shaped, the adjustable heat pipe being in thermal contact with the first plate and the second plate. |
地址 |
Santa Clara CA US |