| 发明名称 |
Holding structure of substrates |
| 摘要 |
A multiple substrate assembly has a metallic plate sandwiched in between two printed circuit substrates. The metallic plate has cut and erect segments passing through thru-holes formed in at least one substrate, so that printed circuit paths on the outer surfaces of the substrates can be grounded to the metallic plate.
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| 申请公布号 |
US4725920(A) |
申请公布日期 |
1988.02.16 |
| 申请号 |
US19850785784 |
申请日期 |
1985.10.09 |
| 申请人 |
ALPS ELECTRIC CO., LTD. |
发明人 |
IJICHI, SADAYOSHI;UMEMOTO, TETSURO |
| 分类号 |
H01R4/64;H01R12/51;H05K3/20;H05K3/34;H05K3/36;H05K3/40;H05K3/46;H05K7/04;H05K7/14;(IPC1-7):H05K7/20 |
主分类号 |
H01R4/64 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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