发明名称 PACKING PLATE FOR SPUTTERING TARGET
摘要 PURPOSE:To conveniently and easily exchange a target by forming a packing plate for a sputtering target with two parts, joining the parts with screws, and pouring a metal which is liquid at room temp. into the joint. CONSTITUTION:The target 101 for sputtering is fixed to a first packing plate 103 with a solder 102, the packing plate 103 is joined to a second packing plate 107 by screws 104, and alloy of InGa, etc., which is liquid at room temp. is poured into the joint 105 between both packing plates 103 an 107, the second packing plate 107 is fixed to a cathode main body 109 with screws 106, and a refrigerant such as water is passed through a space 108 formed by the plate 107 and the main body 109. When the target 101 is exchanged, the screws 104 are loosened, and the target is exchanged along with the first packing plate 103. The target on be conveniently and easily exchanged in this way without touching at a the cooling zone 108 in the cathode 109 with the hand.
申请公布号 JPS6335770(A) 申请公布日期 1988.02.16
申请号 JP19860177981 申请日期 1986.07.29
申请人 SEIKO EPSON CORP 发明人 YAMAGISHI TOSHIHIKO
分类号 C23C14/34;G11B7/26;G11B11/10;G11B11/105 主分类号 C23C14/34
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