发明名称 UN METODO PARA MOLDEAR Y RECUBRIR UN SUBSTRATO EN UN MOLDE
摘要 <p>A method of molding and coating in a mold a thermosetting substrate includng the steps of forming the substrate between at least two separable dies which form a mold cavity therebetween, curing the substrate to the point that the substrate is receptive to a coating, injecting the coating into the mold cavity at a pressure substantially in excess of the mold cavity pressure while maintaining the dies in position whereby the coating is forced over the desired surface of the substrate and curing the coated substrate.</p>
申请公布号 ES557773(D0) 申请公布日期 1988.02.16
申请号 ES19550007773 申请日期 1987.10.26
申请人 THE SHERWIN-WILLIAMS COMPANY 发明人
分类号 B29C39/10;B29C37/00;B29C39/12;B29C43/14;B29C43/18;B29C43/20;B29C45/14;B29C45/16;B29K75/00;(IPC1-7):B29C43/18 主分类号 B29C39/10
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