MASK FOR FORMING CIRCUIT

摘要

PURPOSE:To eliminate the need for an etching process at the time for forming circuits by providing an adhesive agent to the surface of a resin layer lined to a back metal and masking the surface. CONSTITUTION:The adhesive agent 1 is provided on the surface of the resin layer 2 lined by the back metal 3 and the mask for forming the desired circuits is formed when holes 4 are formed to the layer 2 by projecting a laser beam thereto. A circuit substrate is formed without etching if the mask is stuck to a metallic substrate by the adhesive agent 1 and the metal 3 is stripped.