DIELECTRIC COMPOSITE MATERIAL STRUCTURE OF POROUS BOTTOM LAYER

摘要

A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of: (1) applying to a substrate a first and second layer of finely divided particles of dielectric solids and glass dispersed in organic medium; and (2) firing the layers to effect volatilization of the organic medium therefrom, liquid phase sintering of the glass components and densification of both layers, the softening point of the glass, the particle size of the glass and the ratio of glass to dielectric solids in both layers being adjusted in such manner that when the layers are fired, the first layer is porous and the second layer is nonporous.