| 摘要 |
<p>PURPOSE:To manufacture a full mold type photocoupler disusing a dual structure by a method wherein a light emitting device and a photodetector are sealed in a single transparent resin outside of which is covered with a light-shielding resin cover. CONSTITUTION:A light emitting device 1 loaded upon a lead frame 2 and a photodetector 4 loaded upon another lead frame 5 are opposed to each other to be mold-formed by transparent resin 7. Besides, outer leads 3, 6 of light emitting device 1 and the photodetector 4 are led out respectively in the same sides of lead frames 2, 5 to be sealed in the mold. Outside of transparent resin 7 is covered with a light-shielding box type covers 8, 9 to be bonded using bonding agent. Resultantly, no air gap is made between the light emitting device and photodetector due to thermal stress, etc., in operation so that the breakdown strength does not deteriorate and a photocoupler of a high quality can be manufactured.</p> |
