| 摘要 |
PURPOSE:To remarkably reduce the width of a device, which has been seen from its operating surface side of the device, and to obtain the device of a small size and a ultra thin size, by installing a photoelectric converting element onto a plane of a substrate, and installing an IC and a printed circuit board to the side face of the substrate. CONSTITUTION:Many pieces of photoelectric converting elements 2 which have been arrayed and placed in one line at an equal interval are installed to one place on a substrate 13, and to both its side faces, an IC 11 and a printed circuit board 12 is installed. A part between each photoelectric converting element 2 and the IC is brought to wire bonding with a wire 15 such as an aluminum wire or a gold wire, etc. Also, the IC 11 and the printed circuit board 12 are connected to each other by wire bonding in the same way. In this way, irrespective of a size of the IC 11, and a size of the printed circuit board 12 which necessitates a prescribed width, as for width W1 of the whole photoelectric converter, it will suffice that only the width of the photoelectric converting element 2 is taken into consideration, and a remarkably compact device is obtained.
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