发明名称 PHOTODETECTING SENSOR PACKAGE
摘要 Disclosed is a light receiving sensor package. According to the present invention, the light receiving sensor package comprises: a base substrate; a light receiving sensor placed on the base substrate; a molding unit configured to entirely cover an upper surface of the light receiving sensor, except for a portion of an upper surface; and a light penetration unit facing the upper surface of the light receiving sensor with a portion of a gap with the molding unit. The purpose of the present invention is to provide a light receiving sensor package capable of minimizing an error which possibly occurs when an external environment changes.
申请公布号 KR101639741(B1) 申请公布日期 2016.07.14
申请号 KR20150042302 申请日期 2015.03.26
申请人 PARTRON CO., LTD. 发明人 KIM, TAE WON;JUNG, YOUNG WOO;KIM, KYU SEOB
分类号 H01L31/08;H01L31/04;H01L31/048 主分类号 H01L31/08
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