| 摘要 |
<p>PURPOSE:To increase the size of a conductor plate and a lead part and to design their size independently by a method wherein the conductor plate and the lead part are formed collectively on the same frame by keeping some space between them and, after the frame has been folded onto a semiconductor chip, the lead part is set at the required position on the conductor plate. CONSTITUTION:If a frame is piled up onto a semiconductor chip 6 by folding it at a required part of the tie-bar 3, a lead part 20 protrudes over a conductor plate 1 and the lead part 20 is arranged at a required position on the conductor plate 1. Then, after the semiconductor chip 6 and a prescribed lead 2 of the lead part 20 have been connected by means of a connecting wire 7, this assembly is sealed by means of a resin material 5. Through this constitution, the size of the conductor plate and the lead part can be expanded independently of each other so that the biggest possible size for a resin sealing process can be obtained. Therefore, a big chip can be housed into a small package.</p> |
