| 摘要 |
<p>PURPOSE:To accomplish a high density mounting by making a sealing case small in size as well as to contrive accomplishment of high efficiency by shortening the length of leads from a semiconductor element by a method wherein a plurality of lead-out columns of external lead terminals are provided on each side of the sealing container. CONSTITUTION:A plurality of external lead terminals 2a and 2b are led out on a semiconductor case from each side of a sealing container 1 in which a semiconductor element 3 will be housed. Said external lead terminals 2a and 2b are arranged in two rows on the upper and the lower sides on each side of the sealing container 1, the upper external lead terminal 2a is formed in such a manner that its lower side is bent outward, and the lower side of the lower external lead terminal 2b is bent inward. Also, the external lead terminals 2a and 2b are conncted to a semiconductor element located inside the sealing container 1 through the intermediaries of fine metal wires 4a and 4b. Then, in the state wherein the semiconductor element 3 is housed in the sealing container, the external lead terminals 2a and 2b are soldered to the connection pads 6a and 6b on a wiring substrate 5. As a result, the density of mounting can be enhanced, and the lead length from the semiconductor element can be made short.</p> |
