| 摘要 |
PURPOSE:To simplify processes, by providing swelled parts at the corner parts of a strip-frame shaped metallized part, thereby omitting the supply of a solder material at the corner parts of the strip-frame metallized part. CONSTITUTION:At the central part of a ceramic package 1, a cavity 2, in which an integrated circuit chip is accommodated and bonded, is provided. A strip- frame shaped metallized part 6 is formed around the cavity part 2. Swelled parts 6b are provided at corner parts 6a of the metallized part. On the surface of the metallized part 6, a solder layer made of a gold-tin alloy is formed. Even though the solder material, which is fused at the corner parts 6a, flows to side parts 6a' in soldering, the sufficient solder material remains at the swelled parts 6b. Therefore, the shortage of the solder material does not occur at the corner parts 6a. |
