| 摘要 |
PURPOSE:To obtain the titled composition having low residual stress and excellent resistance to moisture and temperature cycle test and useful for the sealing of electronic parts, etc., by compounding a polyether polyol to an epoxy resin, a novolac phenolic resin and a filler. CONSTITUTION:The objective composition can be produced by using (A) an epoxy resin, (B) a novolac phenolic resin, (C) a polyether polyol containing ether bond in the molecule and having primary hydroxyl group, secondary hydroxyl group or dimethoxymethylsilyl group at molecular terminal (e.g. the compound of formula) and (D) an inorganic filler as essential components. The amounts of the components C and D are 0.1-10(wt)% and 25-90% based on the resin composition, respectively. The equivalent ratio of the epoxy group of the component A to the phenolic hydroxyl group of the component B is preferably 0.1-10. |
