发明名称 BONDING WIRE AND WIRE BONDING METHOD
摘要 PURPOSE: To effectively and easily bond a bonding wire blank to an insulating outer cylinder by forming the cylinder of a synthetic resin having an inner diameter larger than the outer diameter of a conductive material and thermal shrinkage and thermally shrinking it except a part to be bonded and the vicinity thereof. CONSTITUTION:An insulating outer cylinder 2 is thermally shrinked until its inner diameter becomes larger than the outer diameter of a conductive material 1 and it is integrated with the material 1 by thermal shrinkage. A synthetic resin having the thermal shrinkage is provided. When a bonding wire 3A wound on a winding support, i.e., the material 1 padded through the cylinder 2 is supplied from left to right side at a predetermined speed in a direction of an arrow, a laser light source 32 is turned ON and OFF at a preset timing. The part irradiated by a laser light 30 of the wire 3A is thermally shrinked, a laser light reflected by a mirror 31 is irradiated thereto to uniformize the thermal shrinkage amount. The cylinder 2 thus thermally shrinked except the part 3a and the vicinity is integrated with the material 1 disposed inside. Thus, the desired bonding wire 3 is automatically continuously obtained.
申请公布号 JPS6333831(A) 申请公布日期 1988.02.13
申请号 JP19860177491 申请日期 1986.07.29
申请人 HITACHI LTD 发明人 KOJIMA TOSAKU
分类号 H01B7/00;H01L21/60 主分类号 H01B7/00
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