| 摘要 |
PURPOSE:o miniaturize an IC package by erecting a wire from a surface electrode for an IC while sealing the IC and the wire with a resin so that only the tip section of the wire is exposed and using a section exposed from the resin of the wire as an electrode. CONSTITUTION:An IC 3 is die-bonded and wire-bonded with a loading section 2 in a lead frame 1, and the outer circumference of a wire bonding section for the IC 3 is sealed with a resin 5. The outer circumference of the wire bonding section is sealed with the resin 5 through a method such as transfer mold. The resin 5 in the peripheral section of the IC 3 and terminals 4 are removed. The upper tip sections of wires 6 connected to electrodes 7 for the IC 3 and erected are exposed by polishing the surface of the resin 5, and the upper tip sections of the wires 6 exposed are employed as electrodes 7. Accordingly, a sealing resin also need not hold the terminals, thus miniaturizing an IC package.
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