| 摘要 |
An embodiment relates to a light emitting device, a method of manufacturing the light emitting device, a light emitting device package, and a lighting system. The light emitting device according to an embodiment includes a light emitting structure, a bonding layer on the light emitting structure, and a support substrate on the bonding layer. A ratio of the thickness of the bonding layer to the thickness of the support substrate is 0.04 to 0.06. So, the warpage phenomenon of a wafer can be reduced. |
