发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 The present invention relates to a light emitting diode package. According to an embodiment of the present invention, the light emitting diode package comprises: a light emitting board with an electrical circuit; a light emitting unit connected by a bonding wire while the light emitting unit is mounted on the light emitting board to emit light; and a reflector which is arranged on one side of the light emitting board and includes a reflection space in which the light emitting unit is located to reflect light generated from the light emitting unit and a penetration hole which is penetrated to insert and locate the bonding wire, on one side of the reflection space.
申请公布号 KR101646500(B1) 申请公布日期 2016.08.08
申请号 KR20150060794 申请日期 2015.04.29
申请人 M-VISION CO., LTD. 发明人 LEE, GU YOUL;KIM, YUN MIN
分类号 H01L33/60;H01L33/62 主分类号 H01L33/60
代理机构 代理人
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