摘要 |
The present invention relates to a light emitting diode package. According to an embodiment of the present invention, the light emitting diode package comprises: a light emitting board with an electrical circuit; a light emitting unit connected by a bonding wire while the light emitting unit is mounted on the light emitting board to emit light; and a reflector which is arranged on one side of the light emitting board and includes a reflection space in which the light emitting unit is located to reflect light generated from the light emitting unit and a penetration hole which is penetrated to insert and locate the bonding wire, on one side of the reflection space. |