| 摘要 |
A hermetically sealed integrated circuit package having a rectangular base member and a similar frame member 11, the frame 11 having an internal feature X positionally related to the adjacent external corner Y to a very high degree of accuracy. The external dimensions of frame 11 are slightly larger than those of the rest of the package so that when the package is assembled corner Y stands proud of the rest of the package 13. This enables an internal element of the packaged chip to be located accurately. <IMAGE> |
