PROCESS AND APPARATUS TO STRIP THE PROTECTION LAYER FROM A PRINTED CIRCUIT COATED WITH AN EXPOSED PHOTORESIST

摘要

The apparatus comprises a board-clamping device for clamping a printed circuit board at an edge thereof in a predetermined position, at least one pair of gripping jaws, which can be moved toward and away from the plane of travel for the printed circuit boards by a movement having a component in the peeling direction, which is oblique to the direction of conveyance. The two gripping jaws of said pair are adapted to be closed in that only one jaw of said pair is moved in the peeling direction. Each of the jaws of the pair has an edge which is parallel to the plane of travel and transverse to the peeling direction. Said edge is engageable with the printed circuit board. Said edges of the gripping jaws of said pair define between them a nip. The apparatus also comprises a conveyor, which defines a plane of travel for each printed circuit board and serves to move each printed circuit board to a position in which the printed circuit board is engageable by the gripping jaws of said pair thereof.