发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To stop moisture from reaching stage bars for the enhancement of moisture-proof features by a method wherein a structure is adopted wherein stage bars extending from a stage fail to reach the sides of a resin package and terminate inside said resin package. CONSTITUTION:Stage bars 15 and 16 extending from a stage 12 fail to reach the side walls 17a and I7b of a resin package 17 and constitute ends 15a and 16a inside the resin package 17. With the ends 15a and 16a of the stage bars 15 and 16 thus being contained within the resin package 17 and not exposed on the side walls 17a and 17b of the resin package 17, the possible passages of moisture to reach a semiconductor element 11 are virtually blocked. A semiconductor device 10 built in this method is provided with a moisture-proof feature far superior to that a device of the conventional design is equipped with.
申请公布号 JPS6331149(A) 申请公布日期 1988.02.09
申请号 JP19860174854 申请日期 1986.07.25
申请人 FUJITSU LTD;FUJITSU BUI LSI KK 发明人 KAWAHARA TOSHIMI;SONO RIKURO;HAYASHI HIROAKI
分类号 H01L23/50;H01L21/56;H01L23/28;H01L23/31 主分类号 H01L23/50
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