发明名称 MANUFACTURE OF PACKAGE WITH WINDOW FOR SEMICONDUCTOR
摘要 PURPOSE:To make larger the effective area of the opening part of a window as well as to lessen the effect of stress to the window material by a method wherein a rapid heating treatment is performed on a metallic component having the window to form a low-melting point glass layer on the neighboring region of the window and after the low-melting point glass layer is reheated, the window material is installed. CONSTITUTION:First, a low-melting point glass layer 13 is once fixed on the neighboring region of the window 11 of a metallic component. Then, the low- melting point glass layer 13 is reheated and a window material 14 is installed. Therefore, the outlow of the lowmelting point glass is prevented and the opening region of the window can be kept making large sufficiently. Moreover, as the low-melting point glass layer 13 is once fixed, a weight for fixing is dispensed with in the case of equipment of the window material 14, and at the same time, a masking material is also unnecessary. As a result, the manufacturing process can be made into a simple one.
申请公布号 JPS6331140(A) 申请公布日期 1988.02.09
申请号 JP19860173941 申请日期 1986.07.25
申请人 TOSHIBA COMPONENTS KK 发明人 YONEKURA HIROMI
分类号 H01L23/02;H01L33/00;H01S5/00 主分类号 H01L23/02
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