| 摘要 |
<p>Process for activating substrates for electroless metallisation A gentle and inexpensive process for activating surfaces for electroless metallisation comprises wetting the surfaces with an activating solution containing a silver-I compound which is sparingly soluble in water (for example AgCl) and which has been converted into a soluble form with the aid of complexing agents (for example NH3), splitting the soluble complex compound back into the sparingly soluble compound and reducing the silver-I compound remaining on the surface.</p> |
