| 摘要 |
A method and apparatus are provided for photofabrication on a three-dimensional solid surface using a laser light beam (2) which is projected onto the surface which has previously been coated with photoresist. Mechanism (8, 9) is provided for moving the workpiece (3) so that all those parts of the photoresist layer are brought in turn into the exposure position. The photoresist is subsequently chemically developed to provide a patterned area of exposed underlying surface for further additive or subtractive physical or chemical processing. One of many applications would be the production of non-planar printed circuit boards for electronic applications.
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