发明名称 EPOXY-RESIN-BASE RESIST INK COMPOSITION
摘要 <p>PURPOSE:To obtain the title composition which has excellent flexibility, adhesiveness, heat resistance and electrical properties and moderate cure rate, and can be used in screen printing, by mixing an epoxy resin, an imidazole compound, and a long-chain dibasic acid anhydride. CONSTITUTION:100 pts.wt. epoxy resin (A) is mixed with 1-15pts.wt. imidazole compound (B) selected from among 2-ethyl-4-methylimidazole, 1-cyanoethyl-2- ethyl-4-methylimidazole, 2,4-diamino-6-[2-methylimidazolyl-(1)]-ethyl-s-triazine, and a 2,4-diamino-6-[ 2-ethyl-4-methylimidazolyl-(1) ]-ethyl-s-triazine/isocyanuric acid adduct, and a long-chain dibasic acid anhydride (C) comprising a 12-22C intermolecular polyacid polyanhydride of any one of formulas I-IV (wherein n is 3-10) in an amount of 0.05-0.9 equivalent based on one epoxy equivalent of component A. This mixture is kneaded so as to provide a particle size of <=10mum.</p>
申请公布号 JPS6330578(A) 申请公布日期 1988.02.09
申请号 JP19860175345 申请日期 1986.07.24
申请人 SHIKOKU CHEM CORP 发明人 TAKAYAMA YUKIYOSHI;SUZUKI TOSHIHIRO;KODAMA HIROKI
分类号 C09D11/00;C08G59/42;C09D11/10;G03B21/00;G09G3/20;G09G5/00;H04N1/00;H04N5/225;H04N5/765;H04N101/00;H05K3/28 主分类号 C09D11/00
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