发明名称 Thin film circuit substrate
摘要 Disclosed is a thin film circuit substrate which comprises an electrically insulating substrate, and at least one conductor layer and one protecting layer which are formed on the substrate, the insulating substrate having a surface roughness which is equal to or smaller than 0.1 mu Ra when measured as a center line average height. The thin film circuit substrate is suitable for use, for example, in a thermal head.
申请公布号 US4724182(A) 申请公布日期 1988.02.09
申请号 US19860934567 申请日期 1986.11.25
申请人 ALPS ELECTRIC CO., LTD. 发明人 KATO, MASAKAZU;SHIRAKAWA, TAKASHI
分类号 H01B3/00;B41J2/335;H01L23/15;H01L49/02;H05K3/28;(IPC1-7):B32B3/00;B32B15/00;H05B1/00;G01D15/10 主分类号 H01B3/00
代理机构 代理人
主权项
地址