发明名称 |
Thin film circuit substrate |
摘要 |
Disclosed is a thin film circuit substrate which comprises an electrically insulating substrate, and at least one conductor layer and one protecting layer which are formed on the substrate, the insulating substrate having a surface roughness which is equal to or smaller than 0.1 mu Ra when measured as a center line average height. The thin film circuit substrate is suitable for use, for example, in a thermal head.
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申请公布号 |
US4724182(A) |
申请公布日期 |
1988.02.09 |
申请号 |
US19860934567 |
申请日期 |
1986.11.25 |
申请人 |
ALPS ELECTRIC CO., LTD. |
发明人 |
KATO, MASAKAZU;SHIRAKAWA, TAKASHI |
分类号 |
H01B3/00;B41J2/335;H01L23/15;H01L49/02;H05K3/28;(IPC1-7):B32B3/00;B32B15/00;H05B1/00;G01D15/10 |
主分类号 |
H01B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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