发明名称 PICK-UP METHOD OF SEMICONDUCTOR PELLET
摘要 PURPOSE:To eliminate the need for the work widely spreading the sheet for avoiding a contact with an adjacent pellet of a collet, and to shorten a construction work by conducting a series of pick-up operation at a single row unit and positioning pellets except the row at a certain fixed angle to the row during operation. CONSTITUTION:In a process in which a flexible adhesive sheet 2 on which individually separated semiconductor pellets 1 are bonded is fastened to a support and the pellets are peeled from the flexible adhesive sheet 2 through attraction by a collet 11 and taken out, a series of pick-up operation of the semiconductor pellets 1 is performed at a single row unit. The pellets 1 except a row to be picked up are positioned at a certain fixed angle to the row to be picked up during operation. Accordingly, since the collet 11 is brought into contact with corner sections in the peripheries of the pellets 1, the fouling and damage of the pellets 1 are difficult to be generated, and a process in which the sheet 2 on which the pellets 1 are bonded is stretched and the spaces of the pellets 1 are extended is unnecessitated, thus reducing labors, then preventing the disorder of the alignment of the pellets 1.
申请公布号 JPS6329946(A) 申请公布日期 1988.02.08
申请号 JP19860174506 申请日期 1986.07.23
申请人 NEC CORP 发明人 ETO KEIKI
分类号 H01L21/67;H01L21/68 主分类号 H01L21/67
代理机构 代理人
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