| 摘要 |
PURPOSE:To obtain a wire bonding apparatus, by which wire bonding accuracy is improved, by providing a first vertical moving mechanism, which lifts and lowers the entire rotary table, and providing a second vertical moving mechanism, which moves the rotary table up and down independently from the first vertical moving mechanism together in the rotary table. CONSTITUTION:A lift stage 1, on which a rotary table 5 and the like are positioned, is moved up and down relatively largely by an eccentric cam 7. An electricity-strain transducer element 20, which precisely moves the rotary table 5 up and down through a rotary shaft 3, a flange part 18, a roller 19 and the like, is provided. Data such as deviation in position of a focal point and the like, which are obtained through an industrial TV camera, are fed back to a voltage, which is applied to the electricity-strain transducer element 20. Thus precise focusing can be performed. Therefore, the accuracy in position detection of the bonding pads of a pellet 12 and the bonding parts of a lead frame 13 is improved, and the accurate bonded result can be obtained. |
