| 摘要 |
PURPOSE:To enable to improve the cooling power of an LSI package by a method wherein a flat heat pipe is used as the heat dissipating path for a heat generator. CONSTITUTION:The heat generated from the heat generator 1 is dissipated through two paths: the first path whereby the heat is transmitted to the ambient air through an LSI package substrate 2 and the second path whereby it is transmitted to a heat dissipating part 4 through the flat heat pipe 3 in contact with the heat generator 1, and transmitted from there to the ambient air or liquid coolant which flows constantly. However, the most part of heat is dissipated from the second path, i.e. the flat heat pipe 3 through the heat dissipating part 4 because the thermal resistance of the first path whereby the heat is transmitted to the ambient air from the LSI package substrate 2 is very large. In the second path whereby the heat passes from the flat heat pipe 3 to the heat dissipating part 4, the thermal resistance of the entire path is expressed by the sum of the thermal resistance in contact with the heat generator 1 and the flat heat pipe 3, the thermal resistance of the flat heat pipe 3 itself, and the thermal resistance at the time of heat dissipation from the heat dissipationg part 4 to the surrounding. |
