| 摘要 |
PURPOSE: To suppress squeeze-out of low-melting-point glass to the outside, by providing a groove in a package substrate at a sealing part on which a cap and the package substrate are abutted through a sealing material. CONSTITUTION:A groove part 7 is provided in a cap mounting peripheral surface 3. A cap 4, on which low-melting-point glass is applied, is coupled on the cap mounting surface 3 of a package substrate 2 having a step part. The glass is fused in a sealing furnace such as a belt furnace for sealing, and the cap 4 is welded in the inside of the package substrate 2. The cap 4 comprises, e.g., a glass material. The package substrate 2 comprises, e.g., a ceramic material. A semiconductor element 8 is fixed to the bottom surface of a cavity part 1 of the package substrate 2. The element 2 comprises, e.g., a silicon single crystal substrate. Many circuit elements are formed in the chip. One circuit function is provided. In this way, the low-melting-point glass 5 flows into the groove part 7, and the squeeze-out of the glass to the outside can be suppressed. |
