摘要 |
PURPOSE:To simplify a resist by double coating, far ultraviolet ray irradiation and heat treatment processes by a method wherein the resist is hardened by ultraviolet ray irradiation and heat treatment and after covering the part not coated with resist 3 mum thick, the resist on fine patterns is removed. CONSTITUTION:Fine patterns are previously formed of resist 1 mum thick on a specimen 2 with surface step difference around 6 mum thick to harden the resist by ultraviolet ray irradiation and heat treatment. Next, the step difference 6 mum thick is coated with resist 9 3 mum thick to be covered therewith. After covering a source and drain, the resist thereon is removed. Finally, AuGe (900 Angstrom ), Ni (200 Angstrom ) and Au (1200 Angstrom ) are vacuum evaporated and then source and drain electrodes are formed. |