| 摘要 |
<p>A high power plastic LSI integrated circuit package is disclosed having a low resistance thermal path from the integrated circuit die (12) to a metal heat spreader (16) on the top of the package. The thermal path includes a thermally conductive electrical insulator, (14) such as beryllium oxide, sandwiched between the integrated circuit die (12) and the heat spreader (16). The opposing surfaces of the beryllium oxide are metallized and soldered to the die and heat spreader, respectively. Interface between the integrated circuit die (12) and the printed circuit board (30) is effected by a lead frame (32) epoxied to the heat spreader (16) in a manner that avoids contamination of the wire bonding surface. The package provides a junction-to-case thermal resistance of one to two orders of magnitude less than other plastic chip carriers.</p> |
