| 摘要 |
PURPOSE:To make it possible to perform accurate position alignment of a semiconductor substrate even if light cannot be projected on the side of formation, by forming an alignment mark on the semiconductor substrate with a material, which does not transmit light in a wavelength region that transmits through the semiconductor substrate, projecting the light in said wavelength region on the semiconductor substrate, and performing the position alignment of the semiconductor substrate. CONSTITUTION:An alignment mark 5 comprising a material, which does not transmit infrared rays, e.g., aluminum, is formed at the specified position on the surface of a mother chip 4, which is formed with silicon single crystal. A semiconductor pellet 6 comprises silicon single crystal. An alignment mark 5a comprising aluminum is formed on the main surface of the pellet 6, which faces the mother chip 4. After the semiconductor pellet 6 is moved to a specified position, infrared rays are projected from an infrared ray lamp 2. During this period, fine adjustment for matching the alignment mark 5 of the mother chip 4 and the alignment mark 5a of the semiconductor pellet 6 is performed. Thus the accurate positioning of the semiconductor pellet 6 can be carried out. |
