| 摘要 |
<p>PURPOSE:To improve moisture resistance and to decrease the cracking of a package, by forming recessed parts in the cavity of the package for packaging a semiconductor chip, fixing the semiconductor chip in said cavity, and putting a filler such as silicon gel in said cavity. CONSTITUTION:Two recessed parts 12 are formed in the lower surface of a cap part 11. Said cap part 11 is fixed to a base part 2 of a package so that the opening parts of the recessed parts 12 face a jelly state material A (silicone resin in a gel state, polyimide resin or the like). When the jelly state material A is expanded by the absorption of moisture, the expanded part rises up as shown by dotted lines in the recessed parts 12. Therefore, the expanded part is absorbed by the recessed parts 12. The jelly state material A is filled in the part between the base part 2 of the package and the cap part 11 without moving space. Therefore the material A cannot be moved When excessive gravity is applied on an electronic device 1. As a result, a part of a semiconductor chip 4 is not exposed. Unnecessary force is not applied to wires 6. Therefore defects such as short circuits of the wires 6 are decreased.</p> |
