| 摘要 |
PURPOSE:To obtain a perfect wire bonding state, in a thermocompressing bonding type wire bonder, by providing a local heater, which locally heats a wire bonding part, thereby using the conventional thermocompressing bonding and/or ultrasonic waves. CONSTITUTION:A driving part 8 is made to work on a lead frame 2, which is heated by a heat block 1 based on the data of a position recognizing part 7. A local heater 9 is operated only during bonding, and heat shortage on a chip 10 is replenished. Under this state, ball bonding is performed. Thereafter, a capillary 4 is moved to the side of the lead frame. The local heater 9 is operated again only during the bonding, and stitch bonding is performed. Thereafter, a wire 5 is fused and cut with a torch 6, and a ball part is formed. Then, for another electrode on the chip 10, the local heater 9 is operated only during the bonding, and heat shortage on the chip 10 is replenished. Under this state, the ball bonding is performed. Since the bonding is performed with the heat shortage at the bonding part being replenished, high quality wire bonding can be performed. |
