| 摘要 |
Materials, having a low tendency to form external layers, high wear resistance and a recrystallisation temperature matched to the copper alloy carrier, for plug-in contacts consist of palladium with 4 to 20% by weight of bismuth and/or antimony and 0 to 2% by weight of iridium and/or osmium and/or ruthenium and/or rhodium. |
