| 摘要 |
PURPOSE:To prevent chip cracking, chip warping and exfoliation of a bonding agent and to improve the yield rate in die bonding, by bonding the central region of a semiconductor chip, providing a material such as resin film at a peripheral region, thereby filling a gap. CONSTITUTION:A bonding agent 5, in which a central region 3 is thicker than a peripheral region 4, is mounted between a tab 1 and a semiconductor element 2. A material 6 is provided on the peripheral region 4 of the bonding aegnt 5. Pressure is applied from the upper direction, and the device is heated. The semiconductor element 2 is bonded to a lead frame at the central region 3. The peripheral region 4 is not bonded because of the presence of the provided material 6. Thus, a chip can be securely bonded at the central region to the supporting body. Thermal strain can be absorbed in the peripheral region. Therefore, chip cracking and the chip warping can be reduced. Since the chip is not floated from the supporting body in the peripheral region, wire bonding can be performed excellently. |
