发明名称 MOLDING EQUIPMENT
摘要 PURPOSE:To uniformize the quality of molded products by uniformize the pressure of resin sent under pressure from pots to respective cavities by a method wherein a plurality of pots are connected to one another by communicating passages. CONSTITUTION:The cylinders 6, 6... of a plurality of pots 4, 4... are connected to one another by communicating passages 10. Resin tablets R are charged in the pots 4, 4... and respective plungers 7, 7... are simultaneously driven by a driving mechanism 8. The resin tablet R in each pot 4 is pressed by the plunger 7 and sent under pressure through a runner 5 to each cavity 3. In this time, because the interiors of the cylinders 6, 6... of a plurality of the pots 4, 4... are connected to one another by the communicating passage 10, the resins in the respective pots 4 uniformly flow through the communicating passages 10, even if the weights of the respective resin tablets R and the pressing force applied to the tablets differ from one another, resulting in uniformizing the resin in the respective cavities 3 and consequently obtaining molded products having uniform quality.
申请公布号 JPS6328616(A) 申请公布日期 1988.02.06
申请号 JP19860171670 申请日期 1986.07.23
申请人 HITACHI MICRO COMPUT ENG LTD;HITACHI LTD 发明人 KAMEOKA AKIHIKO;ITO FUJIO;NISHI KUNIHIKO;TABATA KATSUTADA
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29L31/34 主分类号 H01L21/56
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