| 摘要 |
PURPOSE:To improve corrosion resistance and retard the progress of oxidation in an atmosphere at approx. 300-350 deg.C by forming at least a part to be soldered with an alloy of Ni and Cu. CONSTITUTION:A thermal resistance layer 6, a metal for adhesion energization 2, a wiring layer 1, a solder overflow inhibition layer 7 and a metal for diffusion prevention 3 are evaporated or sputter-evaporated on a substrate 5 in that order as films. In the case of sputter-evaporation, a resistor film of a Cr-Si-O system is formed in a thickness of approx. 800Angstrom as the thermal resistor layer 6, and a film of Cr having a thickness of approx. 1,000Angstrom is formed as a metal as an energization electrode and for adhesion 2. On this film, a film of Cu having a thickness of approx. 0.2-2mum is formed as the wiring layer 1. Further on this film, a film of Ni-Cu is formed in a thickness of approx. 0.3-0.5mum. |
