| 摘要 |
<p>PURPOSE:To secure soldering performance without lead conductors high in cost, by forming the lead conductors of copper wires plated with silver. CONSTITUTION:Lead conductors 5 are formed by making non-oxygenic copper wires 2, which are 0.6 mm in diameter and which contain about 0.1% of Ag, be covered with a 4-8 mum thick Ag-plating layer 4, and then head processed terminal parts are brazed with a laminate 1 at 250-450% in an atmosphere of inert gas or reducing gas. Successively, a surfaceprotecting material 6 is sticked on the side plane of the laminate 1, and then its heat treatment is performed in the air or semi-air of 180-280 deg.C, and then epoxy resin 7 is formed and sealed by transfer-mold process or the like. The surface of the lead conductors 5 is not discolored in such a process, so that occurrence of soldering defects can be reduced during external connection.</p> |
