RESIN-SEALING METHOD FOR RESIN-SEALED SEMICONDUCTOR DEVICE,申请号JP19860172174-传众专利搜索

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发明名称	RESIN-SEALING METHOD FOR RESIN-SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS6328042(A)	申请公布日期	1988.02.05
申请号	JP19860172174	申请日期	1986.07.21
申请人	NEC CORP	发明人	TAKAHASHI ATSUSHI
分类号	H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29L31/34	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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