| 摘要 |
PURPOSE:To improve the productivity by allowing to adhere a dielectric to a printed circuit board in response to the heating of soldering while soldering other electronic components mounted on the board at a time by an automatic soldering machine, etc. CONSTITUTION:A low-loss dielectric piece and a conductor which forms a strip line are allowed to adhere to the surface of the board at the same time through the operation of adhesive layers 4a and 4b in a process wherein other components 6a and 6b, etc., are soldered. The adhesive layers 4a and 4b preferably have small loss at target UHF or SHF. Epoxy, phenoxy, or polyimide of this kind meet requirements sufficiently when properly thin, hut not optimum in consideration of the main purpose. There is polyethylene of simply intermediate density as an example of a proper adhesive layer. |
